Reduced stress plastic package

摘要: A plastic package (10) with a heat sink (11, 27, 28, 32) has stress relief wall (18, 21, 33) formed on its upper surface. semiconductor die (12) is mounted the such that top of below level 33), and absorbs stresses which otherwise would be applied to (12). The simple fabricate assemble, provides mold lock (23, 24, 31) serves hold material (13) tightly 32). Extra bond (26) can used increase flow without compromising other characteristics (10).