Encapsulated semiconductor package including chip paddle and leads
作者： Angel Orabuena Alvarez , Sean Timothy Crowley
DOI:
关键词:
摘要: A semiconductor package that can accommodate a larger chip while keeping the foot print area afforded to conventional package. The of present invention also has an improved locking strength between paddle and encapsulation material. Additionally, exhibits heat radiation over packages. comprises having plurality bond pads on its upper surface; bonded bottom surface by adhesive; internal leads, each etched part at end facing paddle, which are formed regular intervals along perimeter paddle; conductive wires for electrically connecting leads; body in chip, wires, leads encapsulated material externally exposed their side surfaces surfaces.
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