Method of fabricating a resin mold type semiconductor device
作者： Yoshiaki Wakashima
DOI:
关键词: Semiconductor device 、 Materials science 、 Mold 、 Electrically conductive 、 Composite material
摘要: A resin mold type semiconductor device comprising molded articles for sealing, each consisting of a material and having gap portion thereinside; element positioned in said inside article seminconductor electrodes; electrically conductive leads, sealing one end thereof protruding outwardly from sealing; wires, connecting electrode to lead; an insulation covering at least the surface element.
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