Method of mounting a connection component on a semiconductor chip with adhesives

摘要: A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present pattern covering less than all of the surface, so as to provide void-free interface when bonds top surface chip. brought flowable by heat transferred from itself. include leads having base metal strips trace area underlying and noble portions protruding beyond edge layer. flowable, curable material encapsulates sections. Because sections are free undercuts, same can encapsulated manner during formation component.