Heat dissipative integrated circuit chip package
作者： Toshihiko Watari
DOI:
关键词:
摘要: An integrated circuit chip package has a substrate, plurality of chips, heat radiation plates, cover, sink rigidly mounted on the cover and terminals. The chips are each provided with flexible beam leads body thereof electrically mechanically connected substrate via lead. plates composed good thermal conductor joined one-to-one correspondence by first adhesive material. A is also thermo covers mounting surface held in contact through second terminals attached non-mounting for input output signals to from supplying voltage power source chips.
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