Method of manufacturing a circuit assembly
作者： William E. Cooke
DOI:
关键词:
摘要: A method of manufacturing a circuit assembly is provided. The (10) manufactured according to the present invention includes board (12) and heat sink (22). has first side (16) second (20), each these sides (16, 20) one or more electronic components (14, 18) mounted thereon. (22) also (34) (43), having recessed portion (24) therein. step dispensing curable adhesive (26) between mating surfaces (30, 32) (20) positioning such that component (18) on its aligned with further urging towards another applying through cure (26).
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