Heat sink and cover for tab integrated circuits
作者： James LaGassa , Ehsan Ettehadieh , Erich Selna
DOI:
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摘要: An apparatus providing a heat sink and protective cover for Tape Automated Bonding ("TAB") integrated circuit mounted on printed board. The is comprised of board with plurality thermal vias drilled through it. TAB the over vias. draw then generated by to other side A placed opposite dissipate heat. held in place spring clip which hooks onto molded plastic circuit. easy manufacture efficiently dissipates circuits.
google.de 参考文章(11)
Glenn Beane, Allen Hillman, Clamp for attachment of a heat sink ,(1990)
Jr. Stephen T. Radack, Mounting arrangements for high voltage/high power semiconductors ,(1991)
Adam Hermann, Appliance for releasable fastening of a cooling member to an integrated module ,(1984)
Arthur O. Capp, Capp. Michael L., Heat-conductive metal ceramic composite material panel system for improved heat dissipation ,(1990)
Thomas F. Grapes, Mark S. Schroeder, Timothy M. Fertig, Composite heat transfer means ,(1986)
Henry F. Breit, Joseph M. Gondusky, Karen A. Auguston, Composite material, a heat-dissipating member using the material in a circuit system, the circuit system ,(1990)
Robert E. Dietterle, David A. Rowe, Binneg Y. Lao, Microwave multiport multilayered integrated circuit chip carrier ,(1984)
Rene Septfons, Method and device for cooling an integrated circuit package ,(1988)
Max W. Medley, James H. Ward, Co-planar lead connections to microstrip switching devices ,(1975)
Jean P. Lalfer, Jean C. Vallet, Jacques de Givry, Mounting of electronic microcomponents on a support ,(1989)