Method for assembling a chip carrier to a semiconductor device
作者： Peter J. Brofman , Scott I. Langenthal , John U. Knickerbocker , Kathleen A. Stalter , Sudipta K. Ray
DOI:
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摘要: A semiconductor device having C-4 solder connections is joined to a chip carrier pads suitable for receiving the connections. Sacrificial formed on and then planarized result in good, planar surface profile joining device.
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