Substrate with top-flattened solder bumps and method for manufacturing the same
作者： Tomoe Suzuki
DOI:
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摘要: A method for manufacturing a wiring substrate includes the steps of applying, through printing, solder paste onto plurality pads exposed from main surface substrate; melting applied reflowing, so as to form substantially hemispherical bumps; and flattening top portions bumps pressing flat against portions, thereby forming top-flattened bumps. pad is classified first when located within region above solid layer, second outside this region. In application step, amount each smaller than that pad.
lens.org 参考文章(16)
Toshiya Akamatsu, Yasunori Fujimoto, Kazuyuki Imamura, Osamu Yamaguchi, Method for mounting electronic part and paste material ,(2002)
Peter J. Brofman, Scott I. Langenthal, John U. Knickerbocker, Kathleen A. Stalter, Sudipta K. Ray, Shaji Faroog, Method for assembling a chip carrier to a semiconductor device ,(1998)
Honjin Ogaki-kita-kojou En, Naohiro Ogaki-kita-kojou Hirose, Multilayer build-up wiring board ,(1999)
Warren M. Farnworth, Alan G. Wood, Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures ,(2002)
Warren M. Farnworth, Alan G. Wood, Salman Akram, Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer ,(2000)
James M. Wark, Electrically conductive elevation shaping tool ,(2001)
Tzong Da Ho, Chien Ping Huang, Method of achieving solder ball coplanarity on ball grid array integrated circuit package ,(2000)
Harumi Yagi, Yoshihito Okuwaki, Toshiyuki Nakada, Tsuyoshi Yamamoto, Takeshi Komiyama, Noritsugu Ozaki, Method of forming solder bumps and method of forming preformed solder bumps ,(1998)
Yasuhiro Teshima, Mamoru Niishiro, Shuzo Igarashi, Yukio Sekiya, Yutaka Higashiguchi, Toshio Kumai, Yasuhiro Ichihara, Yasushi Kobayashi, Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device ,(1996)