Bonded two-die device including an integrated circuit (IC) die and a phase-change material (PCM) switch die
作者： Howard David J , Slovin Gregory P
DOI:
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摘要: In a method for wafer-to-wafer bonding, an integrated circuit (IC) wafer and phase-change material (PCM) switch are provided. The IC includes at least one active device, has substrate side metallization side. PCM heat spreading radio frequency (RF) terminal A spreader is formed in the wafer. approach, of bonded to wafer, then heating element between another RF
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