Low-loss and stable fiber-to-waveguide connection utilizing UV curable adhesive
作者： Y. Yamada , F. Hanawa , T. Kitoh , T. Maruno
DOI: 10.1109/68.149904
关键词:
摘要: A low-loss and stable fiber-to-waveguide connection was realized utilizing a newly developed UV curable epoxy resin which has improved humidity durability. The average loss as low 0.09 dB/point with return of 46 dB. increase not observed after heat-cycle test between -40 85 degrees C, high-temperature at or low-temperature C. In high-humidity 70 C 90% relative humidity, the less than 0.2 dB 400 h. >
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sci-hub.se 参考文章(7)
T. Miya, N. Takato, F. Hanawa, Y. Ohmori, M. Yamaguchi, N. Tomita, Arrayed waveguide-type wavelength-insensitive coupler for FTTH networks optical fiber communication conference. ,(1992) , 10.1364/OFC.1992.FA5
Norio Murata, Kouzaburo Nakamura, UV-curable adhesives for optical communications Journal of Adhesion. ,vol. 35, pp. 251- 267 ,(1991) , 10.1080/00218469108041012
N. Shimizu, N. Imoto, M. Ikeda, Fusion splicing between optical circuits and optical fibres Electronics Letters. ,vol. 19, pp. 96- 97 ,(1983) , 10.1049/EL:19830069
D. Marcuse, Loss analysis of single-mode fiber splices Bell System Technical Journal. ,vol. 56, pp. 703- 718 ,(1977) , 10.1002/J.1538-7305.1977.TB00534.X
E. Murphy, T. Rice, L. McCaughan, G. Harvey, P. Read, Permanent attachment of single-mode fiber arrays to waveguides Journal of Lightwave Technology. ,vol. 3, pp. 795- 799 ,(1985) , 10.1109/JLT.1985.1074268
M.J. Wale, Self aligned, flip chip assembly of photonic devices with electrical and optical connections electronic components and technology conference. ,vol. 13, pp. 34- 41 ,(1990) , 10.1109/ECTC.1990.122163
K. Nakamura, N. Murata, T. Maruno, Design and development of optical adhesives for optical communications Review of the Electrical Communication Laboratories. ,vol. 37, pp. 127- 132 ,(1989)