作者: George Frank DeVeau
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摘要: The invention includes an interconnection assembly for coupling optical fibers to respective waveguides of integrated circuit (OIC). OIC preferably formed by adhering a protective plate substrate on which the and its are integrated. In one end assembly, ends exposed. Importantly, have substantially similar thermal coefficients expansion reduce or eliminate stresses strains adhesive when is subjected temperature and/or humidity conditions that different from those under was formed. also fiber array houses portions fibers. first second parts between situated in spaced, parallel relationship corresponding spacing assembly. layer holding together. joined with so aligned enclosures housing protecting