Method for fabricating via holes in a semiconductor wafer
作者： Saligrama N. Subbarao , Ho-Chung Huang
DOI:
关键词:
摘要: A circuit pattern is formed on a front side surface of semiconductor wafer and an apertured photoresist over the pattern. Via holes are then by laser irradiating at sites corresponding to apertures. The back next metallized this adhered plating block means adhesive layer. Electrical connection between substrate made, via electroplated, separated from
lens.org 参考文章(5)
Douglas A. Reed, Multilayer circuit board construction and method ,(1978)
David Richard Decker, Masahiro Omori, Through-substrate source contact for microwave fet ,(1975)
William P. Dugan, John A. Muhr, One hundred percent pattern plating of plated through-hole circuit boards ,(1978)
Richard Allen Wydro, Benjamin Howell Cranston, Method of providing electrically conductive substrate through-holes ,(1967)
Ernest N. Urfer, Walter W. Koste, Recessed metallurgy for dielectric substrates ,(1974)