One hundred percent pattern plating of plated through-hole circuit boards

摘要: A process for manufacturing printed circuit boards having plated through-holes. An epoxy glass substrate is laminated on opposite surfaces by a thin copper foil and subsequently apertures are drilled through the where through-holes desired. The exposed of electroless plated. Then means photoresist, desired images initial plating removed again. again to establish an thickness. in then electro-copper approximate thickness photoresist preferably so that their less than photoresist. electro-solder remaining now chemically provide finished board.