Process for manufacturing hollow multilayer printed wiring board
作者： Takayoshi Imura , Mirsuo Yamashita , Hisami Mitsui , Kiyotaka Miyagawa , Ayako Miyabara
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摘要: A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The is comprised of plurality substrates, superposed upon each other with predetermined space therebetween. Each substrate has signal conductor pattern formed on at least one surface thereof land thereof. plated through holes in pattern, which line another hole neighboring substrates to form continuous or an interstitial hole. layer low melting point metal upper lower end surfaces holes. This serves as connection between two more patterns interlayer adhesion substrates. except substrate, made thermally resistant organic synthetic resin sheet insulation-treated metal.
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