Method of bonding wafers having vias including conductive material
作者： Stephen Joseph Gaul
DOI:
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摘要: A surface mountable integrated circuit and a method of manufacture are disclosed. wafer 110 has die with an 119 in one the wafer. via 130 extends to opposite surface. The sidewall oxide 131 is filled conductive material such as metal or doped polysilicon. may comprise barrier layer adhesion layer. second end can be fashioned prong 233 receptacle 430. Dies vias stacked on top each other mounted printed boards substrate.
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