Study on Si-Based LED Integrated Packaging with Vertical Structure

摘要: We study the influence on the luminous efficiency of Si-based LED with different chip spacing. It is found that the optimal chip spacing is 2mm. Furthermore, multi-chips LED with top and back electrodes, according to a certain permutations and combinations way, are packaged integrally on the independent silver reflective layers. We find the LED integrated package devices have higher driving voltage and lower driving current than traditional LED devices with top and back electrodes. In addition, our study shows that independent silver reflective layers can obtain a better luminous efficiency and thermal property.