Low dielectric constant silica-containing cross-linked organic-inorganic materials based on fluorinated poly(arylene ether)s

摘要: Abstract In this work, for the first time, we describe design and synthesis of novel fluorinated poly(arylene ether)/silica cross-linked materials (FPAE/SiO1.5) through a sol-gel process by using triethoxysilyl-containing polyethers as precursors both organic inorganic networks formation. The polyether-based with active species were synthesized via hydrosilylation reaction between triethoxysilane corresponding allyl-functionalized FPAE under Pt catalysis. Herein, present two approaches hydrolysis groups to silanol ones within chemistry: (1) air moisture (2) ethoxysilyl at interface liquids. mechanical thermal properties FPAE/SiO1.5 studied depending on structure macromolecular chains synthetic route. Scanning electron atomic force microscopies employed investigate morphology resulting silica-containing materials. films flexible tough tensile strength above 25 МPа, exhibited high stability, having initial decomposition temperature about 300°С. For more detailed explanation thermophysical behavior materials, method new organic-inorganic system was developed direct 1,1,3,3-tetramethyldisiloxane. All hydrophobic (water contact angles 102°), low dielectric constants losses room temperature. particular, film prepared from tetrafluorobenzene-based polyether showed ultra-low constant 1.86 at 10 kHz. This makes obtained polymer attractive microelectronics many other emerging applications.