Apparatus for machining workpieces, in particular wafers, in a semiconductor production clean room

摘要: An apparatus is used to machine workpieces, in particular wafers (19), a wet cell semiconductor production clean room (10). A handling device (39) has multiplicity of movement units (49, 54) for one axis (55, 56) each case. The (49; comprise case base section (40, 41, 42; 51), drive element (47, 48; 52) and travelling part (46, 50, 60) which can be moved relative the 51) by means 52). Of parts, (60) provided with gripper (61) gripping wafer (19). Situated working area machining stacking stations (20) processing stations, baths (14, 14a). In order provide an as simple possible optimised from point view particle deposition ensures great freedom particles are situated at least approximately plane sections elements all arranged below (Figure 1).