Apparatus and method for cooling a substrate
作者： Dan Marohl , Kenny King-Tai Ngan
DOI:
关键词:
摘要: Apparatus and a concomitant method of supporting substrate while providing effective backside cooling for the substrate. The apparatus comprises platen having support pins, attached to platen, in spaced apart relation platen. pins cause gap be formed between contains at least one heat transfer medium supply portal that passes through Lastly, flow control assembly, located proximate peripheral edge substrate, controlling
lens.org 参考文章(24)
R Cachon, Semiconductor wafer chuck ,(1970)
Gordon P. Krueger, Reducing particulates during semiconductor fabrication ,(1991)
Mehrdad M. Moslehi, Lamp-heated chuck for uniform wafer processing ,(1993)
Alan F. Morrison, Mei Chang, James F. Roberts, Charles C. Harris, Ashok K. Sinha, Virendra V. S. Rana, Semyon Sherstinsky, Simon Tam, Compound clamp ring for semiconductor wafers ,(1994)
Kenneth J. Bahng, Method and apparatus for cooling wafers ,(1992)
Mitsuaki Komino, Teruo Iwata, Izumi Arai, Yoshifumi Tahara, Kenji Ishikawa, Tadashi Mitui, Stage having electrostatic chuck and plasma processing apparatus using same ,(1993)
Emmanuel N. Lakios, Michael F. McGraw, Substrate transport and cooling apparatus and method for same ,(1988)
Jon M. Ballou, Low compliance seal for gas-enhanced wafer cooling in vacuum ,(1986)
Toshiyuki Nakagawa, Nobuyuki Takahashi, Takashi Akimoto, Temperature control system for semiconductor wafer or substrate ,(1991)
Howard Grunes, Dana Andrews, Avi Tepman, Physical vapor deposition clamping mechanism and heater/cooler ,(1992)