Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure
作者： Grant Kenji Larsen
DOI:
关键词: Surface (mathematics) 、 Electronic engineering 、 Surface structure 、 Layer (electronics) 、 Clamp 、 Materials science 、 Wafer 、 Thermal transfer 、 Coating 、 Electrical conductor 、 Composite material
摘要: A surface structure for contacting a workpiece includes flexible layer adhered to support element and coating on the layer. The has ripples its surface. may be thermally conductive. enhance thermal transfer from are characterized by low particle generation particulate contamination of workpiece. in formed expanding layer, applying expanded then contracting In one application, is utilized an electrostatic wafer clamp. provides high efficiency vacuum processing system when conjunction with pressure cooling gas between structure.
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