作者: Jonathan M. Cooper , Steven L. Neale , Shuailong Zhang , Yongpeng Liu , Joan Juvert
DOI: 10.1063/1.4971348
关键词:
摘要: … to the bias conditions used to manipulate other metallic particles in the OET device. 5. S. … DEP force to a small trap at the edge of the trap and the solder bead feels a similar stiction force …