Polyimide multilayer wiring substrate
作者： Hisashi Ishida
DOI:
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摘要: A polyimide multilayer wiring substrate that includes a plurality of layer blocks, each which include layers, are electrically connected and formed into single body by way an anisotropic conductive film is inserted between adjacent the multiple being manufactured inserting blocks compressing heating so as to form them body. This process inserting, repeated N times provide layered structure including pieces blocks.
lens.org 参考文章(23)
Yoshio Takeda, Heat sensitive type adhesive connector ,(1986)
Kazuhito Ozawa, Method of connecting electronic element to base plate ,(1988)
John S. Schiavo, Leland L. Peart, Copper surface treatment for epoxy bonding ,(1974)
C Watson, J Lau, F Lee, O Abolafia, Electrical interconnect structuring for laminate assemblies and fabricating methods therefor ,(1972)
Joseph G. Hoffarth, John P. Wiley, Keith A. Snyder, Voya R. Markovich, Chi S. Chang, High density circuit board and method of making same ,(1990)
Robert L. Beckman, John J. Reagan, Nancy L. Miller, Peggy J. Parks, Fabrication of a multilayer conductive pattern on a dielectric substrate ,(1988)
David B. Harris, Denise B. Harris, Robert A. Bourdelaise, Victor J. Brzozowski, System for connecting integrated circuit dies to a printed wiring board ,(1990)
Marie-Jeanne Bouzid, Andre Schiltz, Elastomer connector for integrated circuits or similar, and method of manufacturing same ,(1991)
Richard H. Estes, Frank W. Kulesza, Flip chip bonding method using electrically conductive polymer bumps ,(1991)
James A. Loughran, James F. Burgess, Constantine A. Neugebauer, Harold F. Webster, II Homer H. Glascock, Multilayer circuit board fabricated from silicon ,(1987)