Investigation of electroless Au/Cu for microswitches and its contact behavior

摘要: We have realized lateral contact switches using electroless deposition of Au/Cu on Si with all the necessary features including source, gate and drain. The metallization approach is simple effective, allowing for Au/Au inducing near-zero curvature even in long (up to 1 mm length) slender (5 µm × 5 µm) cantilever beams (spring constant 0.02 N m–1). switching time these approximately 80 µs under ambient conditions. lifetime fabricated a function current levels applied between source drain (approximately 3000 cycles load 0.6 mA). capacitance change on- off-states about 3 fF.