Room-temperature bonding for hermetic sealing using electroplated Au seal rings with ultra-smooth surface
作者： Yuichi Kurashima , Atsuhiko Maeda , Hideki Takagi
DOI: 10.1109/ICEP-IAAC.2015.7111056
关键词:
摘要: We evaluated room temperature bonding characteristics of electroplated Au surfaces smoothed by lift-off method and imprint method. As a result, can make strong bonding; on the other hand rough surface very weak bonding. In TEM observation, no delamination was observed at interface, which bonded using smooth replicated process. Hermeticity interface prepared diaphragm structures. good hermetic sealing confirmed
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