Surface activated bonding of silicon wafers at room temperature

作者: H. Takagi , K. Kikuchi , R. Maeda , T. R. Chung , T. Suga

DOI: 10.1063/1.115865

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摘要: … Surface activated bonding is a method to achieve a bonding at room temperature.In the … bonding of silicon wafers. By the method silicon pieces cut from commercial wafer were bonded …

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