Some Experiments on Thermal Contact at Low Temperatures

作者: R. Berman

DOI: 10.1063/1.1722369

关键词:

摘要: An apparatus for studying heat contact at low temperatures is described. Measurements of transfer between various surfaces in vacuo have been made. The thermal conductance independent the area and nearly proportional to force them, up forces about 200 lb. At helium all types examined T2, but temperature dependence small nitrogen temperatures. For metal contacts electrical extremely sensitive previous history surfaces, little dependent on this. always much greater than corresponds according Wiedemann‐Franz‐Lorenz law this fact, together with differing behavior two conductances under changing loads, suggests that flow takes place through electrically nonconducting parts surface. main results are collected togeth...

参考文章(9)
David Tabor, The Hardness of Metals ,(2000)
J. G. Daunt, C. V. Heer, Addendum: Heat Flow in Metals Below 1 °K and a New Method for Magnetic Cooling Physical Review. ,vol. 76, pp. 985- 986 ,(1949) , 10.1103/PHYSREV.76.985
C. A. Swenson, Mechanical Properties of Teflon at Low Temperatures Review of Scientific Instruments. ,vol. 25, pp. 834- 835 ,(1954) , 10.1063/1.1771186
R Berman, The Thermal Conductivity of some Polycrystalline Solids at Low Temperatures Proceedings of the Physical Society. Section A. ,vol. 65, pp. 1029- 1040 ,(1952) , 10.1088/0370-1298/65/12/311
R. B. Jacobs, C. Starr, Thermal Conductance of Metallic Contacts Review of Scientific Instruments. ,vol. 10, pp. 140- 141 ,(1939) , 10.1063/1.1751500
M. COCKS, Surface Oxide Films in Intermetallic Contacts Nature. ,vol. 170, pp. 203- 204 ,(1952) , 10.1038/170203A0
S. C. Collins, F. J. Zimmerman, Cyclic Adiabatic Demagnetization Physical Review. ,vol. 90, pp. 991- 992 ,(1953) , 10.1103/PHYSREV.90.991.2
R. Berman, LXVII. The thermal conductivity of some alloys at low temperatures Philosophical Magazine Series 1. ,vol. 42, pp. 642- 650 ,(1951) , 10.1080/14786445108561279
The Thermal and Electrical Conductivity of Copper at Low Temperatures Proceedings of The Royal Society A: Mathematical, Physical and Engineering Sciences. ,vol. 211, pp. 122- 128 ,(1952) , 10.1098/RSPA.1952.0029