作者: Takayuki Kikuchi , Atsushi Ono
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摘要: A manufacturing method of a piezoelectric device includes: forming lid for sealing cavity package base by recess part and through hole in an inner surface the metal plate; fixing to containing vibrating reed so that may project toward side; providing piece part; decompressing via hole; closing applying laser melt piece, wherein, at lid, is formed direction orthogonal thickness plate.