Method of manufacturing electronic device, electronic apparatus, and mobile apparatus
作者： Hideo Miyasaka
DOI:
关键词:
摘要: A method of manufacturing an electronic device including element, a base substrate, and lid member, includes joining the member to sealing part by application energy beam so that plate thickness may be larger in joined than located inside plan view along direction.
lens.org 参考文章(75)
Shigeru Kizaki, Subminiature piezoelectric quartz vibrator ,(1978)
Koichi Kanryo, Masato Higuchi, Atsushi Hirakawa, Shinobu Uesugi, Surface acoustic wave device having a package including a conductive cap that is coated with sealing material ,(2000)
Bernard L Steierman, Joining glass members and encapsulation of small electrical components ,(1962)
Masashi Shimura, Shinya Aoki, Method for manufacturing electronic device, cover body, electronic device, electronic apparatus, and moving object ,(2013)
Kojo Takuya, SURFACE MOUNTED PIEZOELECTRIC VIBRATOR ,(2015)
Takuya Kojo, 琢也 古城, Surface mount type piezoelectric oscillator ,(2013)
Katsumi Ito, Satoshi Suzuki, Method of producing welded structure and method of producing battery ,(2008)
Tsunenori Shibata, Sensor device, manufacturing method of sensor device and electronic apparatus ,(2013)
Takayuki Kikuchi, Atsushi Ono, Manufacturing method of piezoelectric device ,(2010)