Electrical-thermal characterization of wires in packages

摘要: The electrical-thermal co-simulation approaches, for wires-in-air and wires-in-package, are developed by the coupling between their electrical thermal properties, using ADS (Agilent Design System) Symbolically-Defined Devices (SDD) models multiple wire segments. Key parameters these simulation then derived from experimental results. These experimentally validated (or assisted) can be used to predict behavior of bond wires in situations interest, develop design guidelines reliable operation. Test boards with were made, fusing currents on different materials (Au, Cu, Ag), lengths, diameters measured compared published data. Some QFN package testers having materials(Au, diameters, mold material also made characterize real environment. Simulation experiment data, as well some failure-analysis (FA) data through X-ray SEM methods, presented paper.