Electro-thermal simulation of bond wires in power modules for realistic mission profiles
作者： Rafael Goldbeck , Christoph H. van der Broeck , Rik W. De Doncker
DOI: 10.1109/PEDS.2017.8289214
关键词:
摘要: For the successful electrification of global transportation, reliability power electronic modules is major importance. Today, one main reasons for module failure thermo-mechanically induced fatigue bond wires as a result strong load variations. A multitude studies have been conducted to analyze operational stress based on thermal simulations using simple repetitive patterns. This paper proposes compact electro-thermal model detailed time-efficient within wires. It incorporates impact parasitic electromagnetic coupling effects an accurate loss determination over wide frequency range. Finally, wire embedded into system simulation drive train electric vehicle. allows determine realistic temperature distribution along time specific mission profiles.
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