A thermal modeling methodology for power semiconductor modules

摘要: Abstract This work presents a flexible thermal modeling methodology for power semiconductor modules. It allows time efficient simulation of temperature cycling different module designs and operation profiles. To keep the model compact as well accurate, solid state heat conduction paths modules are modeled by 3D finite difference model. is combined with an analytical sink describing convective cooling. The gradient cooling fluid captured mass transportation resulting linear space can be easily formulated in discrete domain to allow fast detailed load transients. With balanced truncation based reduction technique, efficiently reduced analysis reliability issues. Finally, validated measurements data from manufacture.