Front and backside processed thin film electronic devices
作者： Zhenqiang Ma , Mark A. Eriksson , Paul G. Evans , Hao-Chih Yuan , Max G. Lagally
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摘要: BACKGROUND Flexible circuits and electronic devices that combine plas tic Substrates with thin layers of semiconductors are an impor tant emerging technology. These flexible circuits …
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Donald E. Savage, Max G. Lagally, Michelle M. Roberts, Fabrication of strained heterojunction structures ,(2005)
Devendra K. Sadana, Anna Wanda Topol, Stephen W. Bedell, Sampath Purushothaman, Bruce Kenneth Furman, Keith Edward Fogel, Techniques for Layer Transfer Processing ,(2007)
Matthew Meitl, Ralph G. Nuzzo, Zhengtao Zhu, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Etienne Menard, John A. Rogers, Methods and devices for fabricating and assembling printable semiconductor elements ,(2005)
Hiroshi Hayama, Tadayoshi Enomoto, Masaaki Yasumoto, Process for fabricating three-dimensional semiconductor device ,(1985)
E. Menard, R. G. Nuzzo, J. A. Rogers, Bendable single crystal silicon thin film transistors formed by printing on plastic substrates Applied Physics Letters. ,vol. 86, pp. 093507- ,(2005) , 10.1063/1.1866637
Z.-T. Zhu, E. Menard, K. Hurley, R. G. Nuzzo, J. A. Rogers, Spin on dopants for high-performance single-crystal silicon transistors on flexible plastic substrates Applied Physics Letters. ,vol. 86, pp. 133507- ,(2005) , 10.1063/1.1894611
S. Jeon, E. Menard, J.-U. Park, J. Maria, M. Meitl, J. Zaumseil, J. A. Rogers, Three-dimensional nanofabrication with rubber stamps and conformable photomasks Advanced Materials. ,vol. 16, pp. 1369- 1373 ,(2004) , 10.1002/ADMA.200400593
G. K. Celler, Sorin Cristoloveanu, Frontiers of silicon-on-insulator Journal of Applied Physics. ,vol. 93, pp. 4955- 4978 ,(2003) , 10.1063/1.1558223
Katherine L. Saenger, Dean A. Herman, Alfred Grill, Jack Oon Chu, Transferable device-containing layer for silicon-on-insulator applications ,(2004)