The role of cell structure during creep of cold worked copper
作者： Rolf Sandström
DOI: 10.1016/J.MSEA.2016.08.004
关键词:
摘要: Abstract In previous work it was demonstrated that cold could reduce the creep rate of phosphorus doped copper (Cu-OFP) by up to six orders magnitude at 75 °C a given applied stress. Cu-OFP will be used in canisters for final disposal spent nuclear fuel. A dislocation model cell structure deformed material has been formulated. distinction is made between balanced content walls where number dislocations opposite sign match and unbalanced they do not. The recovery much lower than content. Taking this into account, possible curves both 12% 24% worked Cu-OFP. general appearance two sets are distinctly different, which can explained higher state.
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