作者: Heon-Bok Lee , Hyun Jeong Yang , Ju Hyung We , Kukjoo Kim , Kyung Cheol Choi
DOI: 10.1007/S11664-010-1481-0
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摘要: A new process for fabricating a low-cost thermoelectric module using screen-printing method has been developed. Thermoelectric properties of screen-printed ZnSb films were investigated in an effort to develop with low cost per watt. The ZnxSb1−x showed carrier concentration and high Seebeck coefficient when x was the range 0.5 0.57 annealing temperature kept below 550°C. When higher than 550°C, reached that metal, leading decrease coefficient. In present experiment, optimized 7 × 1018/cm3. output voltage power density film 10 mV 0.17 mW/cm2, respectively, at ΔT = 50 K. produced proposed approach CoSb3 as p-type n-type materials, copper pad metal.