Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
作者： Roy Yu , Kimberley A. Kelly , Peter A. Franklin , Frank R. Morelli , Arthur G. Merryman
DOI:
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摘要: A device repair process that includes removing a passivation polyimide layer. The layer is removed using first-half ash followed by second-half ash. then cleaned sodium hydroxide (NaOH) and subsequent light step implemented. After the removed, seed deposited on device. photoresist formed bond sites are in photoresist. Repair metallurgy plated through sites. coupling to fixture applying current for plating fixture. contact between made though bottom surface metallurgy. plating, residual laser delete implemented disconnect isolate nets of
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