Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
作者： Roy Yu , Kimberley A. Kelly , Peter A. Franklin , Frank R. Morelli , Arthur G. Merryman
DOI:
关键词: Sodium hydroxide 、 Photoresist 、 Layer (electronics) 、 Materials science 、 Plating 、 Fixture 、 Metallurgy 、 Coupling (piping) 、 Passivation 、 Composite material 、 Polyimide
摘要: A device repair process that includes removing a passivation polyimide layer. The layer is removed using first-half ash followed by second-half ash. rotated during the then cleaned sodium hydroxide (NaOH) and subsequent light step implemented. After removed, seed deposited on device. photoresist formed bond sites are in photoresist. Repair metallurgy plated through sites. coupling to fixture applying current for plating fixture. contact between made though bottom surface metallurgy. plating, residual laser delete implemented disconnect isolate nets of
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