Stylus profiler monitors chemical mechanical planarization performance

作者: J. Reilly

DOI: 10.1109/ASMC.1994.588289

关键词:

摘要: This paper describes the use of stylus-based surface profilers in advanced semiconductor device manufacturing to monitor chemical mechanical planarization (CMP) performance.

参考文章(1)
W. L. Guthrie, W. J. Patrick, E. Levine, H. C. Jones, E. A. Mehter, T. F. Houghton, G. T. Chiu, M. A. Fury, A four-level VLSI bipolar metallization design with chemical-mechanical planarization Ibm Journal of Research and Development. ,vol. 36, pp. 845- 857 ,(1992) , 10.1147/RD.365.0845