A four-level VLSI bipolar metallization design with chemical-mechanical planarization

作者: W. L. Guthrie , W. J. Patrick , E. Levine , H. C. Jones , E. A. Mehter

DOI: 10.1147/RD.365.0845

关键词: Engineering physicsChemical-mechanical planarizationMaterials scienceVery-large-scale integrationElectronic engineering

摘要:

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