Defect inspection method
作者： Hirohito Okuda , Toshifumi Honda
DOI:
关键词:
摘要: The present invention relates to a defect detection or observation method that detects fine defects in the course of inspection and observation, does not detect locations constituting defects, classifies candidate as grain phenomenon other affect product. In one embodiment, for inspecting product having plurality units formed repetitively at different comprises obtaining an image on appearance be observed; detecting regions each which differs from expected by greater than preset threshold; calculating feature amounts detected regions; classifying into groups candidates; forming aggregate units, determining unit attributes comparing belonging group candidates with distribution candidates.
google.com.mx 参考文章(26)
Harry Stanton Gallarda, Lakshman Srinivasan, Jun Liu, Kais Jameel Maayah, Richard Barnard, Automated repetitive array microstructure defect inspection ,(2001)
Michael Teich, Storage container attachment device ,(2001)
Ashok V. Kulkarni, Paul Rockwell, Detecting groups of defects in semiconductor feature space ,(1997)
Noam Dotan, Mark Wagner, Reliable defect detection using multiple perspective scanning electron microscope images ,(1996)
Mark Wagner, Ariel Ben-Porath, Automatic defect classification with invariant core classes ,(1999)
Jean-Pierre Schott, Golden template comparison for rotated and/or scaled images ,(1995)
Masahiro Watanabe, Asahiro Kuni, Takashi Hiroi, Yasuhiko Nara, Maki Tanaka, Hiroshi Miyai, Chie Shishido, Mari Nozoe, Circuit pattern inspection method and apparatus ,(2001)
David J. S. Michael, Golden template comparison using efficient image registration ,(1994)
Hamed Sari-Sarraf, Shaun S. Gleason, Martin A. Hunt, Context-based automated defect classification system using multiple morphological masks ,(1999)
Ken K. Lee, Bruce W. Worster, Method for characterizing defects on semiconductor wafers ,(2006)