Direct bonding: From an optical technology to a broad research topic

作者: U.K.P. Biermann , A.A. van Gorkum , J.A. Pals

DOI: 10.1016/0165-5817(95)82000-0

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摘要: Abstract For more than thirty years Philips Research has been engaged in direct bonding. A survey is given of how what was first the study an optical technology gradually changed into development special applications semiconductor technology. Cooperation between workshops with mastered dedicated technologies and research groups incentives shown to be indispensable for success. The principles diversity bonding are briefly described, after which impression its stimulating impact on Philips' programme.

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