摘要: When mirror-polished, flat, and clean wafers are brought into contact, they locally attracted to each other adhere or bond. This phenomenon is known as semiconductor wafer bonding. Different adhesion forces (van der Waals forces, hydrogen bonding) the reason for bonding effect at room temperature. The different mechanisms acting in dependence on surface conditions (hydrophilic, hydrophobic) reviewed. Variations of properties bonded interfaces (structural, mechanical, electrical) during annealing discussed. focus low-temperature techniques. Reasons formation interface defects presented. Applications future developments briefly summarized.
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sci-hub.se 参考文章(63)
Jan Haisma, G.A.C.M. Spierings, Contact bonding, including direct-bonding in a historical and recent context of materials science and technology, physics and chemistry historical review in a broader scope and comparative outlook Materials Science & Engineering R-reports. ,vol. 37, pp. 1- 60 ,(2002) , 10.1016/S0927-796X(02)00003-7
J.C. Brice, Condensation and evaporation Solid-State Electronics. ,vol. 7, pp. 489- 489 ,(1964) , 10.1016/0038-1101(64)90049-8
G. W. Trucks, Krishnan Raghavachari, G. S. Higashi, Y. J. Chabal, Mechanism of HF etching of silicon surfaces: A theoretical understanding of hydrogen passivation. Physical Review Letters. ,vol. 65, pp. 504- 507 ,(1990) , 10.1103/PHYSREVLETT.65.504
K. Mitani, U. M. G�sele, Formation of interface bubbles in bonded silicon wafers: A thermodynamic model Applied Physics A. ,vol. 54, pp. 543- 552 ,(1992) , 10.1007/BF00324337
U.K.P. Biermann, A.A. van Gorkum, J.A. Pals, Direct bonding: From an optical technology to a broad research topic Philips Journal of Research. ,vol. 49, pp. 1- 10 ,(1995) , 10.1016/0165-5817(95)82000-0
M. Grundner, H. Jacob, Investigations on hydrophilic and hydrophobic silicon (100) wafer surfaces by X-ray photoelectron and high-resolution electron energy loss-spectroscopy Applied Physics A. ,vol. 39, pp. 73- 82 ,(1986) , 10.1007/BF00616822
Roya Maboudian, Roger T Howe, Critical Review: Adhesion in surface micromechanical structures Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. ,vol. 15, pp. 1- 20 ,(1997) , 10.1116/1.589247
Metin Balci, W. M. Jones, Chirality as a probe for the structure of 1,2-cycloheptadiene and 1,2-cyclohexadiene Journal of the American Chemical Society. ,vol. 102, pp. 7607- 7608 ,(1980) , 10.1021/JA00545A057
M. S. Carroll, J. C. Sturm, M. Yang, Low‐Temperature Preparation of Oxygen‐ and Carbon‐Free Silicon and Silicon‐Germanium Surfaces for Silicon and Silicon‐Germanium Epitaxial Growth by Rapid Thermal Chemical Vapor Deposition Journal of The Electrochemical Society. ,vol. 147, pp. 4652- 4659 ,(2000) , 10.1149/1.1394118
David A. Litton, Stephen H. Garofalini, Modeling of hydrophilic wafer bonding by molecular dynamics simulations Journal of Applied Physics. ,vol. 89, pp. 6013- 6023 ,(2001) , 10.1063/1.1351538