Filling analyses of solder paste in the stencil printing process and its application to process design
作者： Won‐Sang Seo , Jong‐Bong Kim
DOI: 10.1108/SSMT-OCT-2012-0022
关键词:
摘要: … rheological and wetting properties on under‐fill filler settling and flow voids in flip chip packages… Analysis was carried out using commercial COMSOL Multiphysics TM software. The first …
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