An Analysis of Screen Printing using Solder Paste

摘要: In this study, analyses on the stencil printing using solder paste were carried out. The key design parameters in process are conditions, design, and properties. Among these parameters, effects of physical properties such as viscosity, surface tension, contact angle investigated. performed for simple geometry boundary conditions. analysis, was pushed into a hole by pressure instead printer pad. Considering computational efficiency, axisymmetric adopted. A commercial software (COMSOL), which is well known area micro-fluids used. From results, it shown that viscosity had an effect filling speed, while tension shape.