Semiconductor device with improved interconnection of conductor plug
作者： Yoshiyuki Suzuki
DOI:
关键词:
摘要: The semiconductor device comprises a conductor plug 20 and an interconnection 22 having one end connected directly to upper part of the 20. has projection formed at integral with projected in direction from toward inside thereof. is least Because formed, even when pattern largely set back, connection between can be ensured a. Thus, back due micronization high density 22, each other without failure. Accordingly, present invention provide which realize integration while ensuring reliability.
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