Adsorption of mercaptopropionic acid onto Au(1 1 1): Part II. Effect on copper electrodeposition

摘要: Copper deposition in the presence of an organic additive (3-mercaptopropionic acid, MPA) was studied by cyclic voltammetry and situ scanning tunneling microscopy (STM) results are compared to those for additive-free solutions. It is shown that underpotential (upd) copper onto a fully MPA-covered electrode produces defect-rich substrate, but defects blocked dense film bulk deposition, resulting low number nuclei. A grain-refining effect MPA, however, found, when Cu initiated shortly after addition MPA solution, i.e., low-coverage adlayer.