Metallization by plating for high-performance multichip modules
作者： K. K. H. Wong , S. Kaja , P. W. DeHaven
DOI: 10.1147/RD.425.0587
关键词:
摘要: Electrolytic plating is used to produce the interconnect wiring on current generation of high-performance multichip modules in IBM S/390® and AS/400® servers. This paper reviews material manufacturing requirements for successful implementation a multilayer high-density pattern involving electroplated copper metal polyimide dielectric. Various strategies construction thin-film structures (planarized nonplanarized) are outlined, advantages electrolytic over dry deposition techniques described.
acm.org
sci-hub.se 参考文章(26)
C Hassenpflug, J. A Hermann, D Landolt, C Madore, Application of the Rotating Cylinder Hull cell to the measurement of throwing power and the monitoring of copper plating baths Plating and Surface Finishing. ,vol. 82, pp. 36- 41 ,(1995)
Randal D. King, Eda R. Montgomery, Acid copper electroplating bath containing brightening additive ,(1991)
Roger F. Bernards, Gordon Fisher, Wade Sonnenberg, Edward J. Cerwonka, Stewart Fisher, Additive for acid-copper electroplating baths to increase throwing power ,(1991)
Roger Bernards, Patrick Houle, Gordon Fisher, Wade Sonnenberg, Method for analyzing organic additives in an electroplating bath ,(1991)
Gregory Peter Wandy, Mahadevaiyer Krishnan, Randolph Frederick Knarr, Rangarajan Jagannathan, Tetra aza ligand systems as complexing agents for electroless deposition of copper ,(1990)
J. Bartley, A user's view of MCM-D/C packaging: is it worth the trouble? electronic components and technology conference. pp. 144- 148 ,(1996) , 10.1109/ECTC.1996.517386
E. J. O'Sullivan, A. G. Schrott, M. Paunovic, C. J. Sambucetti, J. R. Marino, P. J. Bailey, S. Kaja, K. W. Semkow, Electrolessly deposited diffusion barriers for microelectronics Ibm Journal of Research and Development. ,vol. 42, pp. 607- 620 ,(1998) , 10.1147/RD.425.0607
C. Karakus, D. ‐T. Chin, Metal Distribution in Jet Plating Journal of The Electrochemical Society. ,vol. 141, pp. 691- 697 ,(1994) , 10.1149/1.2054793
Milan Paunovic, Philip J. Bailey, Robert G. Schad, David A. Smith, Electrochemically Deposited Diffusion Barriers Journal of The Electrochemical Society. ,vol. 141, pp. 1843- 1850 ,(1994) , 10.1149/1.2055015
S. Mehdizadeh, J. Dukovic, P. C. Andricacos, L. T. Romankiw, H. Y. Cheh, The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass‐Transfer Effects Journal of The Electrochemical Society. ,vol. 140, pp. 3497- 3505 ,(1993) , 10.1149/1.2221118