Electrochemical behavior of metal interconnects in electronic assemblies
作者： Ling Chunxian Zou , Christopher Hunt
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摘要: The electrochemical and corrosion behaviours of solder alloys, SnAgCu (SAC), SnZnBi, SnPb, Sn, PCB finish materials Cu AuNi has been investigated in carboxylic acids (flux) NaCl solutions using the potentiodynamic scanning technique. work shown that SAC Sn are passivated diluted flux solution, but under active dissolution when anodically polarised. However, passivation alloy is not observed concentrated solution. Although a passive film forms on 2% less stable than solution. In addition, oxidation most commonly used lead?free lead solders, at high temperature evaluated via Sequential Electrochemical Reduction Analysis (SERA). SERA results revealed oxidised more significantly SnPb hot dry condition.
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