Polymer Composition for Microelectronic Assembly
作者： W. C. Peter Tsang , Christopher Apanius , Andrew Bell , Leah Langsdorf
DOI:
关键词:
摘要: Embodiments in accordance with the present invention encompass polymer compositions that are useful assembly of microelectronic components onto a variety substrate materials. Such providing for both holding at desired positions on substrate, fluxing solder bonding such to and remaining place as an underfill components.
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