Tray for aligning semiconductor packages and test handler using the same, and method of aligning semiconductor packages and test method using the same
作者： Sang Il Kim , Jong Won Han
DOI:
关键词:
摘要: Disclosed are a tray for aligning semiconductor packages, test handler using the same, and method of same. According to present inventive concept, packages includes main body comprising plurality package pocket portions at which individually received an air position-aligning unit coupled body. The applies having preset pressure portion. is aligned
lens.org 参考文章(13)
Sang Jun Lee, Test Handlers For Semiconductor Packages and Test Methods Using the Same ,(2011)
Toshiyuki Kiyokawa, Takashi Naito, Semiconductor wafer test apparatus ,(2009)
Yoshiteru Nishimura, Osamu Miyazawa, Masakuni Shiozawa, Handler and test apparatus ,(2013)
Hiroshi Yamada, Wafer inspection interface and wafer inspection apparatus ,(2013)
Bruce Edward Tompkins, Henri Antoine Khoury, A chip registration mechanism ,(1984)
Beom-ho Shin, Heung-bok Kim, Kwang-chun Hwang, Picker for use in a handler and method for enabling the picker to place packaged chips ,(2007)
Dae Gon Yun, Hyo Chul Yun, Yong Sun Kim, Test tray and handler using the test tray ,(2008)
Dennis Mark Romero, Joseph Michael Freund, George John Przybylek, Method and apparatus for handling semiconductor chips ,(1999)
Park Eun-Young, CHIP ARRAY METHOD AND APPARATUS OF CHIP MOUNTER USING STEP-MOTOR ,(2000)
Yasuike Noriyuki, CHARACTERISTICS MEASURING APPARATUS FOR SEMICONDUCTOR PRESSURE SENSOR ,(1997)